Photonic Integrated Circuits (PICs) are at the heart of the next wave of innovation across multiple industries — including telecommunications, sensing, quantum technologies, and biomedical devices. As the demand for compact, energy-efficient, and scalable photonic solutions grows, so does the need for advanced packaging technologies and streamlined manufacturing processes that can support volume production.
From materials to metrology: pushing the limits of lithography
All the Solutions for Developing Chiplets
Building on 70 years of innovation in solid-state circuit design
Transform tomorrow
SLAS Boston 2026 brings the global life sciences and laboratory automation community together for cutting-edge science, innovative technology, and meaningful collaboration.
Celebrating Gaisler’s first 25 years in space
Focused on NAMs and human in vitro models
Experts will discuss advanced techniques to improve silicon photonics for telecommunications, sensing, and computing.

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