Custom chip manufacturing

ASIC services

A custom ASIC allows you to differentiate your product through higher performance, smaller form factor, better IP protection, and more.

IC-Link’s CMOS ASIC offering includes:

• A wide range of technology nodes down to N2
• Partnerships with commercial foundries, including TSMC as Value Chain Alliance (VCA) member
• Flexible business models including full turnkey
• Design capabilities across digital, analog and mixed signal
• Packaging solutions including 2.5D/3D design and production
• Testing development, qualification and supply chain management services to serve high-volume customers

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PIC services

Differentiate your application by harnessing the high performance and low power consumption of a silicon photonics integrated circuit (PIC).

IC-Link's 200mm silicon photonics platform, iSiPP200 offering includes:

• A complete, state-of-the-art PDK, regularly updated with new advancements, coming from imec’s leading photonics research program
• Flexible volumes thanks to foundry access
• Service model to go from idea to production
• Additional photonics platforms on the roadmap

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Custom wafer process services

Get access to manufacturing capabilities without a standard flow. These include:

• Custom-developed imagers and detectors, from design to production based on imec’s R&D
• Fine-resolution wafers using state-of-the-art lithography tools
• CMOS post-processing: unique capabilities that can be combined with photonics, advanced lithography, and more

Example project: From circuit design and specialty Si-processing to seeing atoms

Advanced packaging services

A broad range of mainstream to advanced packaging techniques is available through our ASIC partners. This is complemented by selected imec-developed 2.5D and 3D packaging services.

Examples include:

• 2D packaging: ball grid array (BGA), land grid array (LGA), wafer-level chip-scale packaging (WLSCP), multi-chip module (MCM), system in package (SiP)
• 2.5 packaging: via packaging partners, imec-developed solution coming in 2026
• 3D packaging: via packaging partners, imec solution under development

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