Custom chip manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
IC-Link provides customized solutions for innovative chip manufacturing, built on imec’s semiconductor expertise. Next to silicon production, the division includes services spanning from design through packaging, assembly, qualification, and supply chain management.
Technologies range from ASICs in CMOS, including the most advanced commercially available nodes, to imec-developed integrated photonics, custom wafer processes, and 2.5D and 3D packaging. This portfolio continually expands with new platforms fresh from R&D once they are commercially validated.
ASIC services
A custom ASIC allows you to differentiate your product through higher performance, smaller form factor, better IP protection, and more.
- IC-Link’s CMOS ASIC offering includes:
- A wide range of technology nodes down to N2
- Partnerships with commercial foundries, including TSMC as Value Chain Alliance (VCA) member
- Flexible business models including full turnkey
- Design capabilities across digital, analog and mixed signal
- Packaging solutions including 2.5D/3D design and production
- Testing development, qualification and supply chain management services to serve high-volume customers
PIC services
Differentiate your application by harnessing the high performance and low power consumption of a silicon photonics integrated circuit (PIC).
IC-Link's 200mm silicon photonics platform, iSiPP200 offering includes:
- A complete, state-of-the-art PDK, regularly updated with new advancements, coming from imec’s leading photonics research program
- Flexible volumes thanks to foundry access
- Service model to go from idea to production
- Additional photonics platforms on the roadmap
Custom wafer process services
Get access to manufacturing capabilities without a standard flow. These include:
- Custom-developed imagers and detectors, from design to production based on imec’s R&D
- Fine-resolution wafers using state-of-the-art lithography tools
- CMOS post-processing: unique capabilities that can be combined with photonics, advanced lithography, and more
Example project: From circuit design and specialty Si-processing to seeing atoms
Advanced packaging services
A broad range of mainstream to advanced packaging techniques is available through our ASIC partners. This is complemented by selected imec-developed 2.5D and 3D packaging services.
Examples include:
- 2D packaging: ball grid array (BGA), land grid array (LGA), wafer-level chip-scale packaging (WLSCP), multi-chip module (MCM), system in package (SiP)
- 2.5 packaging: via packaging partners, imec-developed solution coming in 2026
- 3D packaging: via packaging partners, imec solution under development
Press releases
23 October 2025
Imec sets electro-optic performance record in thin-film strontium titanate at cryogenic temperatures
Published today in Science, this breakthrough in material engineering accelerates the roadmap for quantum applications
Press releases
6 October 2025
AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco join imec’s GaN power electronics program track on 300mm as first partners
Press releases
2 October 2025
Achieving a net data rate of 400Gb/s per lane, imec’s GeSi EAM heralds a new generation of compact, high-bandwidth, low-latency, and energy-efficient modulators – tailored for short-reach, scale-up optical interconnects, and manufacturable at silicon scale
Press releases
24 September 2025
Silicon qubits made using advanced industrial manufacturing methods have met key performance criteria, paving the way to mass production of functional quantum computers.
Press releases
22 September 2025
The results underscore the strength of imec’s High NA EUV ecosystem in pushing the boundaries of High NA EUV patterning technology to A10 and beyond logic nodes
Press releases
12 June 2025
Improved contact resistance and RF output key toward mobile-compatible E-mode GaN-on-Si transistors
Press releases
11 June 2025
High-speed DAC paves the way for faster and more energy-efficient optical and electrical links in data centers
Press releases
5 June 2025
A programmable solution for higher-speed wireless communication networks and low-cost microwave sensing
Press releases
3 June 2025
A cost-effective approach to patterning the first local interconnect metal layer of A7 and beyond logic nodes
Press releases
27 May 2025
Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications
Press releases
21 May 2025
Imec will work with multiple MIT labs to explore groundbreaking diagnostic devices and improve quality of life
Press releases
20 May 2025
Industry-wide multipartner collaboration program aims to address the critical need for pre-clinical models in AI-driven drug development
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