/Stories

Stories

Overview
Press releases
Articles
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96-band linescan sensor

Delivering unmatched light sensitivity and low manufacturing variability, imec's latest 96-band hyperspectral sensor is now commercially ready for camera builders.

Brain-computer interfaces

Imec explores together with key leaders in the field the next frontier of brain-computer interfaces and neuromodulation, to make treatments less invasive, and more precise.

PR CAR extension

Press releases

8 September 2026

Imec and its material suppliers optimize their chemically amplified resist (CAR)-based platforms toward High NA EUV single patterning of 22nm pitch line structures supporting A14/A10 logic designs 

PR Sperconducting

Press releases

7 September 2026

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in next-gen HPC, AI, quantum computing, photonics and neuromorphic computing

Wilfried Vandervorst

Testimonial

Wilfried Vandervorst has retired at imec.

Article CFET roadmap part 1

Research update

Imec continues pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold voltage tuning

Geoffrey Pourtois

Testimonial

Geoffrey Pourtois leverages atomistic simulation to accelerate the discovery and development of new materials for nanoelectronics. He is recognized as an industry-leading researcher by both our IDM/foundry and supplier partners and the scientific community.

Karl Tuyls

Testimonial

"As AI and chip design increasingly go hand in hand, I’m thrilled to be at a place where both worlds come together to incentivize breakthrough innovation."

Article Hyperscalers

Technology review

To move data faster, farther, and more efficiently, the AI ecosystem is exploring RF silicon interposer technology that allows to heterogeneously integrate CMOS, BiCMOS, and III-V materials