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Discover why imec is the premier R&D center for advanced logic & memory devices.
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Stories

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PR UWB

Press releases

9 June 2026

Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard

Building on this, imec further demonstrates the first full transceiver architecture compliant with IEEE 802.15.4ab, delivering up to a 32x improvement in ranging performance through combined receiver, transmitter, and IEEE 802.15.4ab standard innovations

PR Hybrid Bonding

Press releases

28 May 2026

Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy

Through their continued collaboration, imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking.

ACP architecture

Vision

From horsepower to high-performance compute: automotive chiplets take the leap towards autonomous edge computing

Imec broadens its Automotive Chiplet Program (ACP) into Autonomous Edge Chiplet Program (AECP)

 

AI Protein engineering

Transforming AI‑driven lab-in-the-loop protein engineering through next‑generation chip technologies

PR HNA Qubits

Press releases

19 May 2026

World first: imec presents quantum dot qubit device using High NA EUV lithography

The most advanced lithography system, crucial for future advanced memory and computer chips, will play a key role in scaling up quantum technology 

PR Venturing

Press releases

18 May 2026

Imec expands the global footprint of imec.ventures with a dedicated US presence

Supporting the creation and scaling of semiconductor deep-tech ventures worldwide

PR 3D CCD

Press releases

12 May 2026

Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications

The feasibility of processing a charge coupled device (CCD) in a 3D NAND-like architecture paves the way for a cost-effective, high-bit-density memory solution to address the memory wall for AI specific workloads

PR TSMC 3DFabric®

Press releases

12 May 2026

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation

Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects

Article AI Drug design

Research update

Flanders’ deep-tech advantage: reinventing the drug pipeline

How imec and VIB are combining strengths to produce invaluable data in preclinical testing