Stories

DTCO study supported by experimental demonstration of hybrid channel orientations which are needed for A3

Dimensional scaling, process simplification, and design flexibility – key drivers of High NA EUV lithography

The findings reveal that controlling gas composition, especially oxygen levels, during critical lithography steps dramatically optimizes metal-oxide resist performance for next-generation, high-throughput EUV patterning.

Imec has made significant progress on its solid-state nanopore system that will enable life science companies to test and develop assays for single-molecule sensing. It is a cost-effective (mass-manufacturable), high-throughput solution.

Patented linearization and switched input buffer techniques ensure precise signal conversion and wide bandwidth at high speeds.

Improving GaN device architectures, substrates, and IC design to boost power conversion efficiencies across industries.

Affordable chip design tools, MPW services and training to empower research and innovation across Europe.