Discover how NanoIC’s early-access PDKs help researchers and industry explore future logic, memory and interconnect technologies.

Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market faster

Manufactured on its 300mm silicon photonics platform, imec's novel APD lays the foundation for the next generation of AI data center optical interconnects

"Interdisciplinary collaboration is of high importance in facing complex problems and delivering best-in-class solutions."

Delivering unmatched light sensitivity and low manufacturing variability, imec's latest 96-band hyperspectral sensor is now commercially ready for camera builders.

Imec explores together with key leaders in the field the next frontier of brain-computer interfaces and neuromodulation, to make treatments less invasive, and more precise.

Imec and its material suppliers optimize their chemically amplified resist (CAR)-based platforms toward High NA EUV single patterning of 22nm pitch line structures supporting A14/A10 logic designs 

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in next-gen HPC, AI, quantum computing, photonics and neuromorphic computing

Wilfried Vandervorst has retired at imec.

Imec continues pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold voltage tuning

Geoffrey Pourtois leverages atomistic simulation to accelerate the discovery and development of new materials for nanoelectronics. He is recognized as an industry-leading researcher by both our IDM/foundry and supplier partners and the scientific community.

"As AI and chip design increasingly go hand in hand, I’m thrilled to be at a place where both worlds come together to incentivize breakthrough innovation."