Improved contact resistance and RF output key toward mobile-compatible E-mode GaN-on-Si transistors

High-speed DAC paves the way for faster and more energy-efficient optical and electrical links in data centers

Improved manufacturability and performance compared to the earlier inner wall forksheet

A programmable solution for higher-speed wireless communication networks and low-cost microwave sensing

A cost-effective approach to patterning the first local interconnect metal layer of A7 and beyond logic nodes 

Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications 

Imec enables the ‘curvilinear’ manufacturing ecosystem – from design over OPC and mask to wafer.

Imec will work with multiple MIT labs to explore groundbreaking diagnostic devices and improve quality of life

Imec proposes different material and integration options in response to the evolving needs of the DRAM periphery

Industry-wide multipartner collaboration program aims to address the critical need for pre-clinical models in AI-driven drug development 

In-human measurements demonstrate promise for the sensor in clinical trials