22 - 25 September 2025 | Monterey, USA
A leading global forum where experts gather to explore cutting-edge developments in extreme ultraviolet lithography technology
Stitching at high-NA EUV: A first experimental study (Invited Paper)
Author(s): Vincent J. I. Wiaux, imec (Belgium); Natalia Davydova, ASML Netherlands B.V. (Netherlands); Tatiana Kovalevich, Nick Pellens, Ataklti Weldeslassie, Jad Haddad, Vito D. Rutigliani, imec (Belgium); Marcus Newman, Dhruv Tyagi, imec (Netherlands); Soobin Hwang, imec (Belgium); Airat Galiullin, Jeremy Chen, ASML Netherlands B.V. (Netherlands); Adam Lyons, ASML US, Inc. (United States); Frank Timmermans, ASML Netherlands B.V. (Netherlands); Cyrus Tabery, ASML (United States)
High-NA stitching: Model and OPC assessment for logic metal printing with a low-n mask (Invited Paper)
Author(s): Qinglin Zeng, Siemens EDA (United States); Dongbo Xu, Siemens EDA (Belgium); Werner Gillijns, imec (Belgium); Xuefeng Zeng, Siemens EDA (United States); Roel Gronheid, KLA Corp. (Belgium); Sandip Halder, Sujan Kumar Sarkar, imec (Belgium); Fan Jiang, Shibing Wang, Yuyang Sun, Germain Fenger, Siemens EDA (United States)
Advances of dry resist towards next-generation lines-spaces patterning in high-NA EUV lithography (Invited Paper)
Author(s): Ali Haider, Zhengtao Chen, Shruti Jambaldinni, Anuja De Silva, Lam Research Belgium BV (Belgium); Rich Wise, Lam Research Corp. (United States); Matteo Beggiato, Christophe Beral, Hyo Seon Suh, Danilo De Simone, imec (Belgium)
Impact of MOR anomalies on lithography and OPC: Challenges and solutions (Invited Paper)
Author(s): Pervaiz Kareem, Werner Gillijns, imec (Belgium)
Unraveling the role of environment on the lithographic performance of metal oxide resists: Key role of oxygen during post-exposure bake (Invited Paper)
Author(s): Ivan Pollentier, Fabian Holzmeier, Hyo Seon Suh, Kevin Dorney, imec (Belgium)
Holistic dry resist optimization on bright field EUV contact hole patterning
Author(s): Ching-Chung Huang, Francesco Gullo, Mohand Brouri, Lam Research Belgium BV (Belgium); Anuja De Silva, Andrew Lushington, Nizan Kenane, Boris Volosskiy, Rich S. Wise, Lam Research Corp. (United States); Mihir Gupta, Hyo Seon Suh, imec (Belgium); Bernardo Oyarzun Rivera, Joost van Bree, Herman Nicolai, Gijsbert Rispens, ASML Netherlands B.V. (Netherlands)
Understanding the impact of the EUV photon absorption distribution in a patterned EUV resist and its lithographic performance
Author(s): Danilo De Simone, Vicky Philipsen, imec (Belgium); Alex Vaglio Pret, KLA Italy Srl (Italy), KLA Corp. (United States); Anatoly Burov, KLA Corp. (United States)
Mitigation of pattern collapse in EUV lithography using SCREEN’s novel rinse technology for metal oxide resist
Author(s): Seungjoo Baek, Elke Caron, Wesley Zanders, Andreia Santos, SCREEN SPE Germany GmbH (Germany); Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Seonggil Heo, Jelle Vandereyken, imec (Belgium)
Energy-efficient optical crosslinking system and PFAS-free underlayers in ArFi lithography: Key enablers for sustainable semiconductor technologies and systems
Author(s): Min Seong Jeong, Seoul National Univ. of Science and Technology (Korea, Republic of), imec (Belgium), KU Leuven (Belgium); Seonggil Heo, Jelle Vandereyken, imec (Belgium); Elke Caron, Wesley Zanders, Seungjoo Baek, Andreia Santos, SCREEN SPE Germany GmbH (Germany); Douglas Guerrero, Brewer Science, Inc. (United States); Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Lithography strategies on overlay control of backside processing in complementary field effect transistor (CFET) device (Invited Paper)
Author(s): Rajendra Kumar Saroj, imec (Belgium)
Energy-efficient EUV lithography using PFAS-free, light-curable underlayers for advanced nodes
Author(s): Seonggil Heo, Jelle Vandereyken, Min Seong Jeong, imec (Belgium); Elke Caron, Wesley Zanders, Seungjoo Baek, Andreia Santos, SCREEN SPE Germany GmbH (Germany); Douglas Guerrero, Brewer Science, Inc. (United States); Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Defectivity-aware EUV process window characterization for monolithic complimentary FET HAR and 3D patterning (Invited Paper)
Author(s): Hong-Cheon Yang, Min-Soo Kim, Xiuju Zhou, Christophe Beral, imec (Belgium); Kaushik Sah, Loemba Bouckou, Luca Barbisan, Ganesha Srivallabha Durbha, Roel Gronheid, KLA Corp. (Belgium)
Development of CNT pellicles for mass production and next generation EUV scanners (Invited Paper)
Author(s): Yosuke Ono, Masashi Fujimura, Mitsui Chemicals, Inc. (Japan); Tenga Takahashi, Mitsui Chemicals, Inc (Japan); Takashi Kozeki, Mitsui Chemicals, Inc. (Japan); Marina Timmermans, Ivan Pollentier, imec (Belgium)
Kurt G. Ronse, program director, will chair the Plenary Session (8:00 - 9:50 AM)
Eric Hendrickx, R&D manager, will chair the High NA and Beyond: Joint Session with PM and EUVL (10:20 AM - 12:00 PM)
Tatiana Kovalevich, researcher, will be among the panelists in the discussion titled Trends in mask complexity: a curse or a blessing? Perspectives from mask industry to wafer fabs
The International Conference on Extreme Ultraviolet Lithography is an annual event that serves as a premier international platform for scientists, engineers, and industry leaders to exchange knowledge and insights on the latest advancements in extreme ultraviolet (EUV) lithography. As a cornerstone technology in next-generation semiconductor manufacturing, EUV lithography plays a critical role in enabling smaller, faster, and more energy-efficient microchips. The conference features technical presentations, panel discussions, and collaborative sessions that address both fundamental research and practical implementation challenges, fostering innovation and collaboration across academia and industry.