SPIE Photomask technology + EUV Lithography 2026

Imec will be participating in SPIE Photomask Technology + Extreme Ultraviolet Lithography, the premier international conference for the photomask and EUV lithography community. The event brings together experts to discuss the latest advances in photomasks, patterning, metrology, materials, inspection and repair, mask manufacturing, EUV lithography, and emerging technologies. 

Join us to learn more on our latest breakthroughs and how to work with imec:  

PRESENTATIONS

• PLENARY
  • It's time to futureproof our prosperity by super fueling innovation, enabling next-gen AI
    September 8 • 8:40 AM
    Luc Van den hove, Chairman of imec
• PAPERS
  • Evaluating OPC performance on novel EUV Masks: MoSi vs RuSi multilayer effects on high-NA random logic via designs
    8 September 2026 • 5:00 PM
    Ling Ee Tan¹, Vicky Philipsen¹, Werner Gillijns¹, Jeroen Van de Kerkhove¹, Fergo Treska¹, Wonchan Lee¹, Christina Baerts¹, Bhavishya Chowrira¹, Ching-Chung Huang², Anuja De Silva^{2
    1}imec (Belgium), ²Lam Research Belgium BV (Belgium)
  • Stochastic OPC reducing EUVL failure probabilities by orders of magnitude in computational and in-the-fab experimental validation: learning from the experience (Invited Paper)
    9 September 2026 • 8:00 AM
    Azat M. Latypov¹, Xima Zhang¹, Farruh Shahidi¹, Ingo Bork¹, Fan Jiang¹, Nicolas Besset², Luc Martin³, Nassim Halli³, Stephane Buisson³, Peter De Bisschop⁴, Werner Gillijns⁴, Renyang Meng⁴, Xuelong Shi⁴, Joost Bekaert⁴, Ryoung-han Kim^{4
    1}Siemens EDA (United States), ²Siemens EDA (Belgium), ³Siemens EDA (France), ⁴imec (Belgium)
  • Mitigating pattern collapse in metal oxide and chemically amplified resists using a sublimation-based rinse process
    Elke Caron¹, Seungjoo Baek¹, Wesley Zanders¹, Akihide Shirotori¹, Satoshi Shindo², Masahiko Harumoto², Seonggil Heo³, Jelle Vandereyken³
    11 September 2026 • 9:40 AM
    ¹SCREEN SPE Germany GmbH (Belgium), ²SCREEN Semiconductor Solutions Co., Ltd. (Japan), ³imec (Belgium)
  • Wafer topography effects on CD, LER, and FFL in high-NA EUV lithography
    9 September 2026 • 8:30 AM
    Robert Seidel¹, Florian Gstrein¹, Gurpreet Singh¹, Marta Anguera-Antonana¹, Kshitij Sharma¹, Aditya Bojja Reddy², Mircea Dusa², Wim Bouman^{3
    1}Intel Corp. (United States), ²imec (Belgium), ³ASML Netherlands B.V. (Netherlands)
  • Shorter wavelengths, longer electron paths: A balanced perspective beyond EUV lithography
    9 September 2026 • 10:40 AM
    Alessandro Vaglio Pret¹, Danilo De Simone², Yi Liu³, John Biafore³, Roel Gronheid⁴, Bruce Smith^{5
    1}KLA Corp. (Italy), ²imec (Belgium), ³KLA Corp. (United States), ⁴KLA Corp. (Belgium), ⁵Rochester Institute of Technology (United States)
  • Why chemically amplified resists extension is critical for early High-NA EUV insertion into HVM?
    8 September 2026 • 3:40 PM
    Balakumar Baskaran¹, Guillaume Schelcher¹, Marc Demand², Yusuke Wako³, Nayoung Bae⁴, Bhavishya Chowrira¹, Xiang Liu⁵, Soichiro Okada⁶, Simon Peters², Sujan Sarkar¹, Joern-Holger Franke¹, Van Tuong Pham¹, Ken Ando⁵, Arame Thiam², Victor M. Blanco Carballo¹, Kathleen Nafus⁷, Satoru Shimura⁶, C. K. Chen⁸, Tsann-Bim Chiou^{8
    1}imec (Belgium), ²Tokyo Electron Europe Ltd. (Belgium), ³Tokyo Electron Europe Ltd. (Japan), ⁴TEL Technology Ctr., America, LLC (United States), ⁵Tokyo Electron Ltd. (Japan), ⁶Tokyo Electron Kyushu Ltd. (Japan), ⁷Tokyo Electron America, Inc. (United States), ⁸ASML Taiwan Ltd. (Taiwan)
  • Enabling pitch 28nm curvilinear patterning in 0.33 NA EUV: integrated lithography, etch, and metrology framework
    11 September 2026 • 10:30 AM
    Federica Luciano¹, Balakumar Baskaran¹, Kenichi Miyaguchi¹, Viktor Kampitakis¹, Soobin Hwang¹, Shruti Jambaldinni², Anuja De Silva², Bappaditya Dey¹, Gianluca Martini¹, Jirka Schatz³, Wolfgang Hoppe³, Chih-I Wei⁴, Ryoung-Han Kim¹, Kurt Ronse¹, Victor M. Blanco Carballo¹, Darko Trivkovic¹, Sandip Halder^{1
    1}imec (Belgium), ²Lam Research Belgium BV (Belgium), ³Synopsys GmbH (Germany), ⁴SNPS Belgium B.V. (Belgium)
  • First 0.55 NA EUV lithography results with non-fluorine biomass EUV resist
    8 September 2026 • 4:00 PM
    Kazuyo Morita¹, Yuki Yanagisawa¹, Yana Medvedeva², Mohamed Zidan², Yuki Yoshikura¹, Harumi Sunaga¹, Yuki Tamura¹, Sotaro Fukumoto¹, Daiki Watai¹, Jelle Vandereyken³, Ryuichi Saito^{1
    1}Oji Holdings Corp. (Japan), ²Oji Holdings Corp. (Belgium), ³imec (Belgium)
  • Extendibility of 3D engineered resist films for 0.55 NA EUV Lithography: bright field hexagonal contact holes and random via patterning
    8 September 2026 • 4:20 PM
    Shruthi Santhosh Nair¹, Wonchan Lee¹, Ching-Chung Huang², Mihir Gupta¹, Ling E. Tan¹, Zhengtao Chen², Hyo Seon Suh¹, Anuja De Silva^{3
    1}imec (Belgium), ²Lam Research Belgium BV (Belgium), ³Lam Research Corp. (United States)
  • Evolution of latent images and nanomechanical properties of metal oxide resists through EUV processing
    8 September 2026 • 4:40 PM
    Dowon Kim¹, Kevin Dorney¹, Albert Minj¹, Nemanja Peric¹, Peter De Wolf², Cassandra Phillips², Ivan Pollentier¹, John Petersen^{1
    1}imec (Belgium), ²Bruker Nano, Inc. (United States)
  • Material and process optimization of dry resists for high‑NA EUV patterning using a Ru direct metal etch (DME) electrical test vehicle
    11 September 2026 • 8:20 AM
    Zhengtao Chen¹, Ali Haider¹, Shruti Jambaldinni¹, Anuja De Silva¹, Elisabeth Camerotto¹, Etienne de Poortere², Victor M. Blanco Carballo³, Martin O'Toole⁴, Danilo De Simone³, Stefan Decoster³, Alejandro Berdonces Layunta³, Cyrus Tabery⁵, Tsann-Bim Chiou^{6
    1}Lam Research Belgium BV (Belgium), ²ASML Leuven (Belgium), ³imec (Belgium), ⁴ASML Leuven (Belgium), ⁵ASML (United States), ⁶ASML Taiwan Ltd. (Taiwan)
  • Contour-based metrology and feature classification of curvilinear EUV mask patterns for 0.55-NA lithography
    8 September 2026 • 6:00 PM
    Balakumar Baskaran¹, Joost Bekaert¹, Kenichi Miyaguchi¹, Darko Trivkovic¹, Soobin Hwang¹, Xiaolong Wang¹, Chieh-Miao Chang¹, Bojja Aditya Reddy¹, Vicky Philipsen¹, Vito Daniele Rutigliani¹, Anne-Laure Charley¹, Philippe Leray¹, Kurt Ronse¹, Ryan Ryoung Han Kim¹, Tatsuro Okawa², Wataru Ito², Hideaki Komami², Kazuo Mukawa^{2
    1}imec (Belgium), ²Advantest Corp. (Japan)
  • Integrating fully PFAS-free photoresist-underlayer stacks in ArFi lithography
    8 September 2026 • 6:00 PM
    Presenter/Author
    Taewon Kim^1,2, Seonggil Heo², Jelle Vandereyken², Elke Caron³, Wesley Zanders³, Seungjoo Baek³, Douglas J. Guerrero⁴, Akihide Shirotori⁵, Masahiko Harumoto^{5
    1}Pohang Univ. of Science and Technology (Korea, Republic of), ²imec (Belgium), ³SCREEN SPE Germany GmbH (Germany), ⁴Brewer Science, Inc. (United States), ⁵SCREEN Semiconductor Solutions Co., Ltd. (Japan)
• NETWORKING EVENT
  • Women's Networking Lunch
    10 September 2026 • 12:00 PM
    Speakers: Vicky Philipsen (imec), Vidya Vaenkatesan (ASML), Kimberly Pierce (Intel), Allison Bezden (Gelest)
    Moderator: Anuja De Silva (Lam Research)

ORGANIZATION

• Photomask Technology Chair
  Vicky Philipsen, imec (Belgium)
• International Conference on Extreme Ultraviolet Lithography Chair
  Kurt G. Ronse, imec (Belgium)