Engineering - Leuven | More than two weeks ago
Future generation logic and memory devices such as complementary field effect transistors (CFET) and 4F2 DRAM or 3DDRAM are moving to complex 3D integration schemes to boost performance and keep up with density scaling trends. That sets unprecedented challenges for novel material and thin film process development. Atomically controlled deposition processes in complex 3D structures: highly conformal depositions of multi-compound materials with homogeneous properties in vertical and lateral cavities, low thermal budget processes, processes with precise interface control and uniformity for both dielectric and metallic films, sustainable materials and processes. In this context, the Materials-Interfaces-Deposition-Analysis (MIDA) department at imec is looking for junior and senior process engineers with a thin film deposition background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD) and/or Physical Vapor Deposition (PVD).
You will be part of one of the thin film deposition teams within the MIDA department. The MIDA department is responsible for the research and development of novel thin films and thin film processes in imec’s 300 mm pilot line using state-of-the-art deposition and characterization equipment. As a process engineer, you will be responsible for material enablement and thin film process developments in application-oriented projects that are done within imec’s industrial research programs or within bilateral or funded projects. DOE design and execution, complex process recipe creation, and characterization of the deposited films will be part of your responsibilities.
Depending on your seniority level and expertise, you can own the full cycle of next generation thin film process development from request to report, which includes the writing of technical reports and procedures to transfer the developed processes to imec’s pilot production line or to external customer sites.
You will have frequent interactions with both internal and external customers, and interact regularly with the FAB engineering group to troubleshoot in case of process drift, to align on tool plannings, and to contribute to operational improvements that will optimize the FAB’s cycle time.
You will be incorporated in a team of enthusiastic, highly engaged process and R&D engineers and scientists, that will provide guidance and trainings, and that will challenge you to grow in your role of process development engineer Thin Film Deposition.
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.