Master projects/internships - Leuven | About a week ago
Develop image analysis techniques to extract accurate overlay using SEM/EDR data, to enable high-resolution overlay metrology for sub-nm scaling.
As semiconductor technology advances toward sub-nm nodes enabled by high-NA Extreme Ultraviolet (EUV) lithography, precise layer-to-layer overlay control becomes increasingly critical alongside aggressive pitch scaling. For advanced nodes, on-device overlay estimation and validation using high-resolution techniques such as SEM, TEM, and EDR become essential alongside. However, manual inspection and analysis of large image datasets are inefficient and incompatible with high-volume manufacturing requirements.
This Master’s internship project aims to develop an automated, high-resolution SEM image-based overlay metrology approach, combining advanced image processing and algorithm development to enable accurate on-device overlay detection.
The key objectives:
Candidate Profile:
Master's degree: Master of Engineering Technology, Master of Engineering Science, Master of Science
Required educational background: Computer Science, Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology
Duration: 12 months
University promotor: Stefan De Gendt (Chemistry, Nano)
For more information or application, please contact the supervising scientist Rajendra Kumar Saroj (rajendra.kumar.saroj@imec.be).