Stories

Why ecosystem collaboration is the only way forward.

Neuromorphic compression technology lays the foundation for scalable brain-computer interfaces (BCIs)

A journey into the benefits, trade-offs and technical implications of moving to chiplets 

As AI workloads drive a steep increase in memory capacity, imec explores ferroelectric memory technologies to address the cost and density constraints of classical DRAM.

The new integration approach implements sub-100nm self-aligned through-Si via connections, enabling low-resistance and low-leakage front-to-back connections with good overlay performance 

Novel 300mm integration approach for 2D-material based devices enables scaled n and pFETs with 50nm contacted poly pitch