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[NanoIC topic] Electrical and mechanical properties of IMC layers for fine pitch microbumps in 3D technology
Leuven | Just now
Understanding and predicting the IMC growth in solid and liquid phases is key for the performance of 3D stacked electronics chips. PhD student will experimentally measure this growth and then will use simulation tools to predict the lifetime of the product.
§Problem statement, scientific challenge
§IMC growth mechanisms in liquid or solid phase through reaction and diffusion for 3D applications is a rich and challenging field linking materials science and technology
§Experiments and phase field simulation are often used for thorough description and mechanisms study
§Electrical and mechanical properties of IMCs at RT and above melting point of solder material
§Research objectives, goals
§Mechanical and Electrical characterization of for example Cu/Sn, Ni/Sn and Ni/Cu/Sn IMCs
§Defining a model to predict the IMC growth at different temperatures for microbumps pitches ranging from 100um down to 5um
§Propose a stable metallurgical system for different applications
§Methodology/workplan
§In-situ electrical resistance test, mechanical test, SEM, XRD, EDX and EBSD of IMCs
§Phase filed simulation of IMCs for bump scaling
Required background: physics, material science, electrical engineering
Type of work: 50% experimental 40% simulation 10% literature
Supervisor: Kristof Croes
Co-supervisor: Jaber Derakhshandeh
Daily advisor: Jaber Derakhshandeh
The reference code for this position is 2026-134. Mention this reference code on your application form.