Master projects/internships - Leuven | More than two weeks ago
Dive deep into VLSI implementation technologies and the methodologies
Imec performs exploratory research on the near-future CMOS technologies nodes. In the Physical Design Research (PDR) team, we focus on the implications of future CMOS device architectures (e.g. nanosheet, CFET, 2D FET, etc.) at the library- and block-level (e.g. processor, NoC, 3D). We do pathfinding for future technology enablers by Design Technology Co-Optimization (DTCO) and System Technology Co-Optimization (STCO) cycles.
Advancing along the CMOS scaling roadmap from FinFET to nanosheet and to CFET device architectures, introduces several changes on standard cell library design. As Back-end-of-Line (BEOL) metal line dimensions downscale to the deca-nanometer range, the pin shapes and arrangements of standard cells can highly influence the interconnect resistance/capacitance and routing quality of the final design.
In this study, the student will evaluate the QoR (quality of results) impact of standard cell pin shapes and their distributions at the block-level Place and Route (PnR) experiments for a processor core.
In this internship project:
Entering the nanosheet transistor era
Imec puts complementary FET (CFET) on the logic technology roadmap
Enabling Sub-5nm CMOS Technology Scaling Thinner and Taller!
Design enablement of CFET devices for sub-2nm CMOS nodes
Type of Project: Internship
Master's degree: Master of Science; Master of Engineering Science; Master of Engineering Technology
Master program: Electrotechnics/Electrical Engineering; Nanoscience & Nanotechnology
Duration: 3-4 months
For more information or application, please contact Halil Kuekner (halil.kukner@imec.be)
Imec allowance will be provided for students studying at a non-Belgian university.