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Testimonial

'Everything starts with a thought'

Margot Niels

Jakob Declercq

<p>Breakthroughs in heterogeneous photonic integration are charting a path toward future, scalable data center interconnects</p>

Research update

<p>Researchers from imec and Ghent University have successfully transfer-printed thin-film lithium niobate modulators onto imec’s silicon photonics platform – an industry first.</p><p>In parallel, they were the first to heterogeneously integrate a lithium tantalate modulator on a silicon photonic integrated circuit (PIC).</p><p>The researchers view these breakthroughs as key milestones in heterogeneous photonic integration, demonstrating the potential to seamlessly integrate emerging materials through micro-transfer printing – thus setting the stage for the next generations of optical interconnects.</p>

A double world-first: integrating lithium niobate and lithium tantalate modulators on silicon photonics through micro-transfer printing

John Kourentis

Bart Plackle

<p>Arm’s perspective on advancing modular chiplets for the automotive sector</p>

Arm: a partner spotlight on imec’s Automotive Chiplet Program (ACP)

Celestial AI’s journey from concept to AI computing unicorn.

Venture support for advanced optical interconnect

Subal Sahni

Preet Virk

<p>From concept to unicorn AI Computing: Celestial AI’s journey</p>

Longread

Deep-tech venture support for advanced optical interconnect technology

Honoring his work in advancing high-performance computing and AI.

Jensen Huang receives the 2026 imec Lifetime of Innovation Award

Jade Liu

<p>Honoring Huang’s groundbreaking work in advancing high-performance computing and artificial intelligence</p>

Imec names NVIDIA’s Jensen Huang as recipient of the 2026 imec Lifetime of Innovation Award

A major milestone in propelling industry into the ångström era.

<p>A major milestone in propelling industry into the&nbsp;ångström era</p>

Imec receives the world’s most advanced High NA EUV system

<p>Leveraging European academic excellence to accelerate industrial innovation.</p>

Imec launches university consortium around next generation of chips

Leap forward thanks to multilinear quantum dot array enabled by EUV lithography.

Sofie Beyne

Clement Godfrin

Stefan Kubicek

Kristiaan De Greve

<p>Multilinear quantum dot array enabled by EUV lithography promises leap forward in scaling up.</p>

Page-turner

<p>In its quest to develop useful quantum computers, the quantum community spreads its efforts across two areas: developing ‘better’ qubits and enabling ‘more’ qubits.</p><p>Si quantum dot spin qubit technology provides an attractive platform that can address both challenges.</p><p>High-fidelity spin qubit operations – a prerequisite for large-scale quantum computing – were reproducibly demonstrated on quantum dot structures fabricated with imec’s optimized 300mm fab-compatible process flow.</p><p>Two key innovations now mark another leap forward in the race to scale up: (1) the use of EUV lithography to enable full 300mm wafer printability with excellent reproducibility, and (2) the transition to scalable quantum dot device architectures to address the wiring bottleneck.</p>

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