
Featured in the media
Discover how NanoIC’s early-access PDKs help researchers and industry explore future logic, memory and interconnect technologies.

Press releases
23 September 2026
Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market faster.
Press releases
21 September 2026
Manufactured on its 300mm silicon photonics platform, imec's novel APD lays the foundation for the next generation of AI data center optical interconnects

Testimonial
"Interdisciplinary collaboration is of high importance in facing complex problems and delivering best-in-class solutions."

Press releases
8 September 2026
Imec and its material suppliers optimize their chemically amplified resist (CAR)-based platforms toward High NA EUV single patterning of 22nm pitch line structures supporting A14/A10 logic designs

Press releases
7 September 2026
New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in next-gen HPC, AI, quantum computing, photonics and neuromorphic computing