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Stories

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PR 3D CCD

Press releases

12 May 2026

Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications

The feasibility of processing a charge coupled device (CCD) in a 3D NAND-like architecture paves the way for a cost-effective, high-bit-density memory solution to address the memory wall for AI specific workloads

PR TSMC 3DFabric®

Press releases

12 May 2026

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation

Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects

Article AI Drug design

Research update

Flanders’ deep-tech advantage: reinventing the drug pipeline

How imec and VIB are combining strengths to produce invaluable data in preclinical testing

AI low-power wireless

Vision

Low‑power wireless: a crucial link between AI and the physical world

How next-gen UWB and BLE can bring efficient data flows and spatial awareness to edge intelligence.

Automotive chiplets

Testimonial

Arm: a partner spotlight on imec’s Automotive Chiplet Program (ACP)

Arm’s perspective on advancing modular chiplets for the automotive sector

PR SPINS quantum pilot line

Press releases

3 April 2026

Semiconductor-based quantum pilot line ‘SPINS’ launched with EU support

PR HNA Intallation

Longread

High NA EUV: a new generation of EUV lithography is ready to shape our future

Why the High NA EUV tool may become the steam engine of our time.

Luc Van den hove

Interview

From lab to leadership: Luc Van den hove reflects on a remarkable journey – from researcher to imec CEO

Luc Van den hove steps into his new role as Chairman of imec. Time to reflect on his journey: from a young researcher to the CEO of the world's leading chip R&D lab.

Article Combined Lithium

Research update

A double world-first: integrating lithium niobate and lithium tantalate modulators on silicon photonics through micro-transfer printing

Breakthroughs in heterogeneous photonic integration are charting a path toward future, scalable data center interconnects