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CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
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Take a look at technologies for optical transceivers, sensors and more.
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See how imec brings the power of chip technology to the world of healthcare.
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Explore imec’s CMOS- and photonics-based sensing and actuation systems.
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We create and co-create new ventures, and we invest in and accelerate existing ventures.
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Imec supports formal and on-the-job training for a range of careers in semiconductors.
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Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
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Stories

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PR 2D materials TSMC ASML

Press releases

15 June 2026

ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

Novel 300mm integration approach for 2D-material based devices enables scaled n and pFETs with 50nm contacted poly pitch

PR RF Interposer

Press releases

11 June 2026

Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding

Collaboration signing IMEC and TUe

Imec and TU/e formalize a shared vision for semiconductor innovation

PR UWB

Press releases

9 June 2026

Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard

Building on this, imec further demonstrates the first full transceiver architecture compliant with IEEE 802.15.4ab, delivering up to a 32x improvement in ranging performance through combined receiver, transmitter, and IEEE 802.15.4ab standard innovations

PR Hybrid Bonding

Press releases

28 May 2026

Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy

Through their continued collaboration, imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking.

ACP architecture

Vision

From horsepower to high-performance compute: automotive chiplets take the leap towards autonomous edge computing

Imec broadens its Automotive Chiplet Program (ACP) into Autonomous Edge Chiplet Program (AECP)

 

AI Protein engineering

Transforming AI‑driven lab-in-the-loop protein engineering through next‑generation chip technologies

PR HNA Qubits

Press releases

19 May 2026

World first: imec presents quantum dot qubit device using High NA EUV lithography

The most advanced lithography system, crucial for future advanced memory and computer chips, will play a key role in scaling up quantum technology 

PR Venturing

Press releases

18 May 2026

Imec expands the global footprint of imec.ventures with a dedicated US presence

Supporting the creation and scaling of semiconductor deep-tech ventures worldwide