Development of a Novel Dry-Film Resist Process for Wafer-to-Wafer Bonding

Internship topic: Development of a Novel Dry-Film Resist Process for Wafer-to-Wafer Bonding

Daily supervisor: Clement Leruth ( Clement.Leruth@imec.be )

Internship introduction

Microfluidics has become a cornerstone technology for modern biomedical, chemical, and environmental applications. This technique has been enabling precise control of fluids at the microscale with reduced sample volumes and faster analysis times. The performance and reliability of microfluidic devices strongly depend on the quality of their fabrication, which remains a major technical challenge.

Achieving high-resolution patterns, reproducibility, and robust sealing is particularly difficult as device architectures become more complex. Fabrication constraints often limit scalability, material compatibility, and integration of new functionalities. To address these challenges, we open this internship to develop a process using a novel dry film resist for microfluidic applications. This work will focus both on improving developing a recipe for this novel resist and optimise the development for wafer-to-wafer bonding. This internship offers you an unique opportunity to work in a team centered on lab scaled development of diverse devices on micro scale.

Techniques to be learned: Microfabrication, lamination, photolithography, wafer to wafer bonding.

Type of project: Master internship

Duration: 3 months

Location: Imec 1 Heverlee