Breakthroughs in heterogeneous photonic integration are charting a path toward future, scalable data center interconnects

Honoring Huang’s groundbreaking work in advancing high-performance computing and artificial intelligence

From concept to unicorn AI Computing: Celestial AI’s journey

A major milestone in propelling industry into the ångström era

Leveraging European academic excellence to accelerate industrial innovation.

Multilinear quantum dot array enabled by EUV lithography promises leap forward in scaling up.

A diverse Finance team, bridging generations of two  international women.

Atlas Data Storage and imec join forces to scale DNA-based data storage.

New advanced interconnect PDKs pave the way for high‑density, energy‑efficient chip‑to‑chip integration.

DTCO study supported by experimental demonstration of hybrid channel orientations which are needed for A3

Dimensional scaling, process simplification, and design flexibility – key drivers of High NA EUV lithography

Imec has made significant progress on its solid-state nanopore system that will enable life science companies to test and develop assays for single-molecule sensing. It is a cost-effective (mass-manufacturable), high-throughput solution.

The findings reveal that controlling gas composition, especially oxygen levels, during critical lithography steps dramatically optimizes metal-oxide resist performance for next-generation, high-throughput EUV patterning.