Multilinear quantum dot array enabled by EUV lithography promises leap forward in scaling up

A diverse Finance team, bridging generations of two  international women.

Atlas Data Storage and imec join forces to scale DNA-based data storage.

New advanced interconnect PDKs pave the way for high‑density, energy‑efficient chip‑to‑chip integration.

DTCO study supported by experimental demonstration of hybrid channel orientations which are needed for A3

Dimensional scaling, process simplification, and design flexibility – key drivers of High NA EUV lithography

Imec has made significant progress on its solid-state nanopore system that will enable life science companies to test and develop assays for single-molecule sensing. It is a cost-effective (mass-manufacturable), high-throughput solution.

The findings reveal that controlling gas composition, especially oxygen levels, during critical lithography steps dramatically optimizes metal-oxide resist performance for next-generation, high-throughput EUV patterning.

Patented linearization and switched input buffer techniques ensure precise signal conversion and wide bandwidth at high speeds.

Improving GaN device architectures, substrates, and IC design to boost power conversion efficiencies across industries.

Affordable chip design tools, MPW services and training to empower research and innovation across Europe.